发明名称 Silver compound paste
摘要 An object of the present invention is to provide a silver compound paste which can be easily applied without containing resin, and which produces a conductive film having a low electric resistivity by heating under conditions substantially equivalent to those in a conductive film containing a polymer type conductive paste. The present invention provides a silver compound paste containing silver oxide particles and a tertiary fatty acid silver salt.
申请公布号 US2004248998(A1) 申请公布日期 2004.12.09
申请号 US20040493999 申请日期 2004.04.27
申请人 HONDA TOSHIYUKI;OKAMOTO KOUJI;ITO MASAFUMI;ENDO MASANORI;TAKAHASHI KATSUHIKO 发明人 HONDA TOSHIYUKI;OKAMOTO KOUJI;ITO MASAFUMI;ENDO MASANORI;TAKAHASHI KATSUHIKO
分类号 H01B1/20;C09D5/24;C09J5/06;H01B1/22;(IPC1-7):C09K3/00 主分类号 H01B1/20
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