发明名称 |
Silver compound paste |
摘要 |
An object of the present invention is to provide a silver compound paste which can be easily applied without containing resin, and which produces a conductive film having a low electric resistivity by heating under conditions substantially equivalent to those in a conductive film containing a polymer type conductive paste. The present invention provides a silver compound paste containing silver oxide particles and a tertiary fatty acid silver salt.
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申请公布号 |
US2004248998(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20040493999 |
申请日期 |
2004.04.27 |
申请人 |
HONDA TOSHIYUKI;OKAMOTO KOUJI;ITO MASAFUMI;ENDO MASANORI;TAKAHASHI KATSUHIKO |
发明人 |
HONDA TOSHIYUKI;OKAMOTO KOUJI;ITO MASAFUMI;ENDO MASANORI;TAKAHASHI KATSUHIKO |
分类号 |
H01B1/20;C09D5/24;C09J5/06;H01B1/22;(IPC1-7):C09K3/00 |
主分类号 |
H01B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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