| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate with pin in which bonding strength between the pin and pin bonding portion is high in reliability in the wiring substrate in which the pin is brazed at the pin bonding portion of the substrate. SOLUTION: Since a length W3 parallel to principal plane of the substrate of a sword guard 123 of a pin 121 is made to fulfill a designated condition, stress concentration is hard to occur at brazing material section between sword guard side face of the pin 121 and a pin bonding portion 111. Therefore, the brazing (bonding) section is hard to break because the stress concentration is hard to happen even if external force applies to the pin 121. Owing to the present invention, the wiring substrate 100 with pin high in electric connection reliability can be obtained in such a way that high bonding strength is obtained. COPYRIGHT: (C)2005,JPO&NCIPI |
