Polishing method and polishing liquid

摘要

The present invention relates to a polishing method and a polishing liquid for polishing a workpiece such as a semiconductor wafer with a fixed abrasive. In the polishing method for polishing a workpiece by pressing the workpiece to be polished against a fixed abrasive and bringing the workpiece in sliding contact with the fixed abrasive, the workpiece is polished while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles.