| 摘要 |
PROBLEM TO BE SOLVED: To provide a bond coat which does not exert a seriously adverse influence on the mechanical properties of a silicon substrate. SOLUTION: The bond coat is used for a silicon substrate and contains an alloy containing a disilicide/a silicon eutectic of a high-melting-point metal. The disilicide of a high-melting-point metal is selected from the group consisting of dislicides of molybdenum, chromium, hafnium, niobium, tantalum, rhenium, titanium, tungsten, uranium, vanadium, and yttrium and their mixtures. The disilicide/silicon eutectic of a high-melting-point metal has a melting point higher than 1,300°C. COPYRIGHT: (C)2005,JPO&NCIPI
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