UNLEADED SOLDER ALLOY AND ELECTRONIC COMPONENTS USING IT

摘要

Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt% copper (Cu), from 0.1 to less than 0.5 wt% nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400 DEG C to 480 DEG C.