发明名称 SEMICONDUCTOR SUBSTRATE TRANSFERRING APPARATUS WITH IMPROVED FIXING MECHANISM AND SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS WITH THE SAME
摘要 PURPOSE: A semiconductor substrate transferring apparatus and a semiconductor substrate processing apparatus with the same are provided to reduce a necessary period for the transfer of a semiconductor substrate and to omit a flat zone aligner by fixing and aligning simultaneously the substrate using an improved fixing mechanism. CONSTITUTION: A semiconductor substrate transferring apparatus includes a transfer arm(110) with a groove(111) for holding a semiconductor substrate, a fixing part, and a driving part. The fixing part(120) is installed on the transfer arm to fix stably the substrate to the groove. The driving part(130) is connected with an end of the transfer arm to provide driving force for transferring the substrate. The fixing part includes a pusher(121) for pushing the substrate and actuator connected with the pusher.
申请公布号 KR20040100030(A) 申请公布日期 2004.12.02
申请号 KR20030032227 申请日期 2003.05.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, GI SANG
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
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