METHOD AND SYSTEM FOR ELECTROLESS PLATING THIN NICKEL FILM BY FLOWING PLATING SOLUTION ONTO SURFACE OF WORKPIECE

摘要

PURPOSE: To provide thin film plating method and system capable of performing plating having a constant thickness without dipping of a work to be plated into a solvent when the work has a complicated structure to which electroplating or electroless plating is difficult to be applied although it has corrosion resistance and wear resistance, and to provide method and system capable of plating a narrow gap formed between parts. CONSTITUTION: The system(10) for electroless plating a thin nickel film comprises a plural tanks(15); driving units(16) capable of respectively extracting contents inside the tanks to the outside; a plating solution input/output part(14) comprising one or more plating solution input/output pipes connected to an end of valves to flow a plating solution, wherein the plating solution input/output pipes comprise a bladder mounted on an outer portion of the plating solution input/output pipes and inflatable when a fluid flows in the bladder, wherein the plating solution input/output pipes are easily inserted between a narrow gap of parts, and the gap is easily sealed by expansion of the bladder, and wherein the bladder is formed in a doughnut shape into the center of which a hole is penetrated, and a plural plating solution input/output pipes are mounted on the bladder.