发明名称 |
Thermally enhanced semiconductor package and fabrication method thereof |
摘要 |
A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.
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申请公布号 |
US2004238945(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20030635168 |
申请日期 |
2003.08.05 |
申请人 |
SILICON PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUANG CHIEN-PING;HSIAO CHENG-HSU |
分类号 |
H01L23/31;H01L23/36;H01L23/433;H01L23/538;(IPC1-7):H01L23/10 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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