| 摘要 |
<p>An electrical connection for a microelectronic chip, and a method for manufacturing such a connection. A method of manufacturing an electrical connection for a microelectronic chip, the microelectronic chip 3, 13, 23, 33 comprises at least one connection pad of reduced size 2, 2A, 2B, 2C, 2D, wherein the method of manufacturing comprises the steps of: - adding an additional layer 11, 11',11", 11A, 11B on the at least one connection pad, - bonding a wire 8 on the additional layer.</p> |
| 申请人 |
AXALTO SA;SCHLUMBERGER MALCO, INC.;GROENINCK, DENIS;BONVALOT, BEATRICE |
发明人 |
GROENINCK, DENIS;BONVALOT, BEATRICE |
