发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT OBTAINED BY USING THE SAME, RESIST PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which exhibits high performances in a well-balanced state with respect to photosensitivity, resolution, plating resistance and tent reliability and produces a reduced amount of sludge. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer including a copolymer obtained by polymerizing a plurality of monomers, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) propylene glycol, wherein the plurality of monomers are (a) (meth)acrylic acid, (b) methyl (meth)acrylate or ethyl (meth)acrylate, (c) an alkyl (meth)acrylate in which the alkyl group has &ge;4 carbon atoms and (d) styrene. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004341130(A) 申请公布日期 2004.12.02
申请号 JP20030136190 申请日期 2003.05.14
申请人 HITACHI CHEM CO LTD 发明人 FUKAYA TAKEHIRO;AJIOKA YOSHIKI
分类号 G03F7/033;C08F2/44;C08F291/00;G03F7/004;H05K3/06;H05K3/18 主分类号 G03F7/033
代理机构 代理人
主权项
地址