Electronic component and package

摘要

An electronic component includes: a package that includes a metal portion formed by pressing a metal, and an insulating portion attached to the metal portion through fusing; a chip housed in the package; first external terminals that are electrically connected to the chip with metal wires, and are partially embedded in the insulating portion; and ground terminals that are convexities of metal portion and are electrically connected to the chip with metal wires, connecting points between the first external terminals and the chip being located at the same height as connecting points between the ground terminals and the chip.