| 摘要 |
PROBLEM TO BE SOLVED: To enhance mechanical strength by not forming an oxide at the joint of the bump on a wiring circuit board having the bump as an interlayer connection means and a metal layer being connected therewith thereby reducing the electric resistance at that joint. SOLUTION: The wiring circuit board has a copper bump 12 formed on the surface part of a first wiring layer 24 of copper, an interlayer insulating film 16 formed at a part of the wiring layer 24 where the bump 12 is not formed, and a second wiring layer 26 of copper formed on the interlayer insulating film 16 to touch the top surface of the bump 12 wherein an alloy layer 20 principally comprising copper and added with at least one kind of Mo, Cr, Ta, Si, W, V, Al and Nb is formed at least at the joint of the bump 12 and the second wiring layer 26 touching the bump 12. Compositional ratio of the additive metal in the alloy layer 20 is preferably set at 0.1-5.0 wt%. COPYRIGHT: (C)2005,JPO&NCIPI |
