| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive hot melt adhesive composition which is of a moisture curing type, has a practical moisture curing rate at normal temperature, does not show a substantial change in viscosity, even when it stays melted for a long period of time and does not give off a toxic vapor or a smell, when heated and melted. SOLUTION: The reactive hot melt adhesive composition is a hydrolyzable silicon group-containing organic polymer with a polyoxyalkylene or the like as its main chain. The ingredients of the composition are (A) a silylated urethane resin having a bond such as a urethane bond or a nitrogen atom derived from Michael addition reaction, (B) a hydrolyzable silicon group-containing organic polymer with a polyoxyalkylene or the like as its main chain and (C) an acidic and basic group-containing compound having a molecular weight of≥500 and capable of curing the resin (A) and the polymer (B). COPYRIGHT: (C)2005,JPO&NCIPI
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