PACKAGE FOR LOADING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a package for loading electronic component that makes wiring layers provided in notched sections formed on the side faces of a wiring board firmly connectable to an external electric circuit by satisfactorily adhering side-face conductor layers composed of plated-metal layers to the wiring layers. SOLUTION: The package for loading electronic component is provided with a mounting section 7 on which an electronic component 2 is mounted and wiring layers 5 to which the electrodes of the component 2 are connected on the main surface of the wiring board 1. The package is also provided with the side-face conductor layers 5a which are electrically connected to the wiring layers 5 in the notched sections 4 formed on either the corners or side faces of the wiring board 1 toward the top surface of the wiring board 1 from the bottom surface of the board 1. The notched sections 4 are formed to the midways between the top surface and bottom surface of the wiring board 1 from the bottom surface, and the side-face conductor layers 5a are formed to the midways between the upper end and lower end of the notched sections 4 from the lower end. COPYRIGHT: (C)2005,JPO&NCIPI