| 摘要 |
PROBLEM TO BE SOLVED: To reduce the loss of high-frequency current by improving the sectional shape of a conductor line in a substrate. SOLUTION: A substrate conductor layer 11 is formed on the main surface of an insulating plate 10, a resist layer 12 is provided on the substrate conductor layer 11, and a resist mask pattern is formed in which the substrate conductor layer 11 of the part for forming the conductor line is exposed. Thereafter, a conductor plating layer 14 is formed by electrolytic plating on the exposed part of the substrate conductor layer 11, the conductor plating layer 14 is formed higher than the resist pattern mask, and the conductor line 2 is formed as a sectional shape having a rounded upper part and no corner. Thereafter, the resist layer 12 is removed, and the unnecessary substrate conductor layer between the conductor lines is removed. COPYRIGHT: (C)2005,JPO&NCIPI
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