| 摘要 |
An optical chip module facilitating positioning of an optical chip and optical fiber, suppressing optical coupling loss, and facilitating mounting on a board etc. to form a module device, specifically, an optical chip module comprised of an optical chip provided on an element forming face with a light emitting or light receiving element part and terminals for electrical connection with the element part and an optical fiber optically bonded by coupling the optical fiber to the element part in the state with its end face made to abut positioned with the element part, the outer circumference of the optical fiber being provided with interconnect patterns extending from the end face of the optical fiber toward the axial direction of the optical fiber and electrically connected with the terminals, terminals of the optical chip being provided in an arrangement positioned with the interconnect patterns at the end face of the optical fiber and intersecting circumferential lines of the end face of the optical fiber abutting against the element forming face, the optical chip and optical fiber being bonded in the state with the end face of the optical fiber abutting against the element forming end face, and the terminals and interconnect patterns being electrically connected, and such an optical chip module device.
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