发明名称 |
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
摘要 |
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.
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申请公布号 |
US2004226745(A1) |
申请公布日期 |
2004.11.18 |
申请号 |
US20040864400 |
申请日期 |
2004.06.10 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
EN HONCHIN |
分类号 |
C25D3/38;H05K1/11;H05K3/10;H05K3/34;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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