| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that although Sn solder is investigated as the solder for Pb-free solder plating for a terminal fixed to an electrochemical cell, when the terminal is fixed to the electrochemical cell by laser welding, whiskers are easily generated from the Sn solder. SOLUTION: The cause of the generation of the whiskers is determined as the influence of the heat in the laser welding, and the generation of the whiskers is suppressed by optimizing Ni or Ni alloy plating on a substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
