| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip fuse in which a manufacturing cost is reduced because the manufacturing is easy and necessary mechanical strength and blow-out precision can be secured in spite the size of the product is formed thin. SOLUTION: In the chip fuse in which the fuse film is installed on an insulating substrate via an adhesive layer, a notch part 11a is formed in a part of the adhesive layer 11 where the blown-out part 14b of the fuse film 14 is overlapped, and this notch part is larger than the blown-out part of the fuse film. Furthermore, a silicone based resin 13 is filled into the notch part of the adhesive layer, and an epoxy resin is used for a protecting layer 15 covering the fuse film. COPYRIGHT: (C)2005,JPO&NCIPI
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