| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit board in which the deformation of a flexible film whose dimension change is likely to be generated due to the influence of heat, humidity, and external force is suppressed, and a highly precise circuit pattern is formed on at least one face. SOLUTION: This method for manufacturing a circuit board is provided to attach a reinforcing board through an organic layer to one face of a flexible film, and to form a circuit pattern on the other face of the flexible film, and to peel the flexible film with the circuit pattern from the reinforcing board. This method is characterized by adjusting the humidity of the flexible film before attaching it through the organic layer to the reinforcing board. COPYRIGHT: (C)2005,JPO&NCIPI
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