| 摘要 |
PROBLEM TO BE SOLVED: To provide a termination feature for a multilayer electronic component. SOLUTION: The plated termination in question is guided and fixed by an exposed internal electrode tab that can be selectively extended on a cover layer of the multilayer component and an anchor tab. Such an anchor tab is arranged inside or outside a chip structure and forms a core of a plating material on which additional metallization has been performed. External anchor tabs arranged on both the top surface and the bottom surface of a monolithic structure make it easy to form a selective wrap-around plated termination. The technique includes an interdigitated capacitor, a multilayer capacitor array, and an integrated passive component and can be used in a plurality of monolithic multilayer components. Various different plating techniques and termination materials can be used for forming a self-determined plated termination in question. COPYRIGHT: (C)2005,JPO&NCIPI |
