发明名称 |
Electronic package with strengthened conductive pad |
摘要 |
<p>An electronic package and information handling system utilizing same wherein the package substrate (11') includes an internally conductive layer (15') coupled to an external pad (13') and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.</p> |
申请公布号 |
EP1473977(A2) |
申请公布日期 |
2004.11.03 |
申请号 |
EP20040250754 |
申请日期 |
2004.02.12 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
ALCOE, DAVID |
分类号 |
H01L23/12;H01L23/498;H05K1/11;H05K3/34;H05K3/46;(IPC1-7):H05K1/11;H01L23/485 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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