发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and keeping adhesion property in a thick film and to provide a photosensitive material using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition contains: (A) a binder polymer; (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule; (C) one or more kinds of sensitizers selected from sensitizers expressed by general formula (1) and general formula (2); and (D) a photopolymerization initiator which can produce a radical by irradiation of light in the presence of the sensitizer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004301996(A) |
申请公布日期 |
2004.10.28 |
申请号 |
JP20030093348 |
申请日期 |
2003.03.31 |
申请人 |
HODOGAYA CHEM CO LTD |
发明人 |
TARUMOTO NAOHIRO;YOSHIKAWA KATSUMASA;ANZAI MITSUTOSHI |
分类号 |
G03F7/004;G02B5/20;G03F7/028 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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