发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and keeping adhesion property in a thick film and to provide a photosensitive material using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition contains: (A) a binder polymer; (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule; (C) one or more kinds of sensitizers selected from sensitizers expressed by general formula (1) and general formula (2); and (D) a photopolymerization initiator which can produce a radical by irradiation of light in the presence of the sensitizer. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004301996(A) 申请公布日期 2004.10.28
申请号 JP20030093348 申请日期 2003.03.31
申请人 HODOGAYA CHEM CO LTD 发明人 TARUMOTO NAOHIRO;YOSHIKAWA KATSUMASA;ANZAI MITSUTOSHI
分类号 G03F7/004;G02B5/20;G03F7/028 主分类号 G03F7/004
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