| 摘要 |
PROBLEM TO BE SOLVED: To provide a sewing device for a semiconductor package production process that can improve productivity and its control method by making it possible to simultaneously achieve the loading of a strip and the unloading of a package when doing a sewing work to produce a semiconductor package. SOLUTION: The sewing device for a semiconductor package production process includes a chuck table base 200, a chuck table 23 installed onto the chuck table base 200 such that it can be moved in a horizontal direction, two chuck plates 233a and 233b installed onto the upper part of the chuck table 23 in a rotatable way and onto whose upper part strips (S) are alternately loaded, a slicing machine 30 that slices a strip (S), loaded onto the chuck plate, into respective packages in a mutual motion with the chuck table 23, and a strip/package picker 22 that simultaneously performs an operation of loading the strip (S) onto the chuck plate and an operation of unloading the package (P). COPYRIGHT: (C)2005,JPO&NCIPI
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