| 摘要 |
An LED head is supplied which is able not only to reduce cost but also to improve disintegration efficiency and assembly efficiency. The LED head comprises a SLA holder with electroconductivity which has a insulating cover and supports a rod lens array with convergency; a substrate which is mounted in the SLA holder and is used for installing a LED array chip; a base with electroconductivity used for fixing the substrate at the SLA holder; and a clamp with electroconductivity which presses and contacts the base, wherein the clamp, while mounted onto the SLA holder, scrapes off contact part of the insulating cover.
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