发明名称 Positive photoresist composition
摘要 Provided is a positive photoresist composition comprising a resin which contains specific repeating units and whose dissolving rate toward an alkaline developing solution is increased by the action of an acid and a compound which generates an acid upon irradiation with an actinic ray or a radiation.
申请公布号 US6808860(B2) 申请公布日期 2004.10.26
申请号 US20010834639 申请日期 2001.04.16
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO;AOAI TOSHIAKI
分类号 G03F7/004;G03F7/039;(IPC1-7):G03F7/004 主分类号 G03F7/004
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