发明名称 SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating device that can improve the yield and, at the same time, can surely perform maintenance work at the time of performing the maintenance of a chamber, and can improve the yield of substrate treatment. SOLUTION: This substrate treating device has a chamber having an opening through which substrates are carried in and out of the chamber and used for treating the substrates, an evacuation means which discharges the atmosphere in the chamber, and a gas supplying means which supplies an inert gas or surface treating gas to the atmosphere in the chamber. The chamber is enabled to be drawn out of the main body of the substrate treating device. This device is also provided with an evacuation locking mechanism and a gas supply locking mechanism which respectively lock a chamber-side connecting pipeline and a substrate treating device-side connecting pipe, constituting the evacuation means and gas supplying means in attachable/detachable states. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004296500(A) 申请公布日期 2004.10.21
申请号 JP20030083111 申请日期 2003.03.25
申请人 HIRATA CORP 发明人 HAYANO KAZUTOMI;FUJIYOSHI MAKOTO
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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