| 摘要 |
A ceramic substrate is provided through a stem of a can-package, the desired number of wirings including the high speed signal wirings are formed on this ceramic substrate and the necessary electronic components other than a light-emitting/photosensitive element such as driver LSI and amplifying LSI or the like are also accommodated within the can-package. Moreover, the solder connecting points of a transmitting can-package and a receiving can-package, which are respectively provided, on the ceramic substrate provided with a can-stem through the same, with the high speed signal transmission wirings of which characteristic impedance is matched with about 50 Omega and a solder connecting point at one end of the high speed signal transmission wiring, and the solder connecting points on the printed circuit board which is provided with a solder connecting point at one end of the high speed signal transmission wiring, mounts a peripheral circuit of the transmitting module and a communication control circuit, and is also provided with a connector board for connecting the optical module to a mother board are connected with the high speed signal transmission wirings of which characteristic impedance is matched with about 50 Omega and a flexible wiring board provided with solder connecting points at both ends of the high speed signal transmission wirings.
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