| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a stress being applied to a semiconductor element when a supporting electrode is press fitted in the fitting hole of a heat sink. <P>SOLUTION: A supporting electrode (1) has an annular protrusion (9a) formed on the side wall (9) to protrude downward from the bottom wall (7), and a bottom face (11) arranged on the inside of the annular protrusion (9a) on the rear side of the inner surface (10) where a semiconductor element (2) is bonded to the bottom wall (7). The bottom face (11) forms a convex surface (14) bending continuously downward from the outer circumferential part (12) being connected with the annular protrusion (9a) toward the central part(13). Since the central part(13) of the convex surface (14) is located at the lowermost position of the bottom face (11) and at an upper position of the annular bottom face (9b), a strain being generated in the bottom wall (7) by a compressive force (P) applied to the side wall (9) at the time of press fit is a microstrain (γ) for moving the central part(13) of the convex surface (14) slightly downward, thereby relaxing a mechanical stress being applied to the semiconductor element (2). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
