| 摘要 |
The module has a non-conducting flat carrier (2) with contact areas (4) on its underside partially open to the top via cut-outs (10,12,14). An IC chip (6) mounted on a chip holding point is electrically connected to at least one exposed contact area via bonded wires (13) and the chip and wires are embedded in a setting material (20). At least one or a few of the cut-outs are in the form of large-area setting material holders whose outer boundary forms a flow barrier for the setting material, whereby bridges (15-17) between these cut-outs mechanically connect adjacent contact areas. |
