| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an electrical short circuit occurs between connecting pads by a solder bridge by an influence of complicated warp of an entire wiring board or the high density of the connecting pads. SOLUTION: The wiring board includes a metallized conductor filled in a cutout formed from the lower end to the upper end of the side face of an insulating base 1 formed to be disposed between the adjacent connecting pads 2 arranged along the side faces of at least opposed two sides of the insulating base 1 and formed at the end face as a reinforming dummy pad 3 by exposing the end face of the one main surface side of the insulating base 1 formed in a band-like state on the side face of the insulating base 1 to form the same surface as the one main surface. A stress generated due to the difference of thermal expansion coefficients applied to the adjacent connecting pads 2 to an outer side of the insulating base 1 can be effectively alleviated. Meanwhile, the connecting pad formed on one main surface can be electrically connected to the terminal pad of the external circuit board surely for a long period, and can incorporate high electrical connecting reliability. COPYRIGHT: (C)2005,JPO&NCIPI
|
