| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for a semiconductor substrate which provides even temperature distribution at a surface to be polished and renders the surface to be in good conditions in carrying out polishing, and to provide a method for polishing a semiconductor substrate. <P>SOLUTION: The polishing pad for a semiconductor substrate is provided at a surface of a plate 4, and comprises a polishing sheet 2 including a through hole 3 and a gel 5 comprising inorganic fine particles 6 and filled in the through hole 3. Letting a mass of the polishing sheet 2 be M and a mass of the gel 5 provided at the polishing sheet 2 be N, percentage of the gel 5 in the entire polishing sheet 2 and gel 5, i.e. N/(M+N), should satisfy the relationship expressed by a formula 0.5≤N/(M+N)≤0.8. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
