| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a balancing type matching circuit wherein miniaturization, weight reduction and cost reduction are realized without being affected by variation in grounding wire. <P>SOLUTION: A semiconductor chip (FET4) for an amplifier is connected with a part between an input matching circuit (12) and an output matching circuit (15). Each of the matching circuits is prepared in an IPD equipped with a balancing type circuit in which the phase of a signal generated from an input signal is different by 180°. A virtual earth point (VE)which is formed by connecting both the matching circuits is used for an earth point which is sensitive to RF characteristics. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
