| 发明名称 |
Adhesion layer for Pt on SiO2 |
| 摘要 |
Si, Al, Al plus TiN, and Ir02 are used as adhesion layers to prevent peeling of noble metal electrodes, such as Pt, from a silicon dioxide (5i02) substrate in capacitor structures of memory devices.
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| 申请公布号 |
US2004197984(A1) |
申请公布日期 |
2004.10.07 |
| 申请号 |
US20040803363 |
申请日期 |
2004.03.17 |
| 申请人 |
INFINEON TECHNOLOGIES CORP;IBM |
发明人 |
LIAN JINGYU;WONG KWONG HON;WISE MICHAEL;LIMB YOUNG;NAGEL NICOLAS |
| 分类号 |
B32B9/04;B32B15/04;H01L21/02;H01L21/8239;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
B32B9/04 |
| 代理机构 |
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