| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding device which calculates the height of a bonding surface before a bonding operation is started using a laser beam that irradiates the bonding surface, sets up a region for an optimal low-speed operation, and provides a shortest bonding time. <P>SOLUTION: The height of the bonding surface is stored as reference data for bonding, and the spot position of a laser beam θ irradiating the same plane is calculated on the basis of a photoed image and stored. In a practical bonding process, the transferred semiconductor chip 1, a board, or a lead frame as a bonding surface is irradiated with a laser beam 17, the amount of deviation of the irradiated spot from the previously stored spot position is calculated, and a height difference is obtained from the calculated amount of deviation to calculate the height of an actual bonding surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
