| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device using a support of new type which affords more various types of designs than a flexible plate-shaped board does, and enables the enlargement of a circuit scale and the suppression of an increase in a board volume simultaneously. SOLUTION: According to a method for manufacturing the semiconductor device, an insulating film is formed on the fibered support, a semiconductor film is formed to make it in contact with the insulating film, and then a semiconductor element is formed using the semiconductor film. In this method, the insulating film or the semiconductor film is formed as the support is rotated on the rotation axis parallel with the longitudinal direction of the support. COPYRIGHT: (C)2004,JPO&NCIPI |
