METHOD OF FORMING THIN-FILM CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a means which is gentle to environment and can contribute to resource saving by inexpensively and surely forming an extremely thin film circuit proper for a high density by a simple process as a circuit of a printed board etc. SOLUTION: By irradiating the surface of a polymeric base material 1 with laser beams L along a circuit pattern, the chemical connection part of a high polymer is selectively dissociated to reform the surface of the base material 1 of an irradiation area Z to be hydrophilic, and a metallic thin film 3 is adhered to an irradiation area Z by non-electrolytic plating. COPYRIGHT: (C)2004,JPO&NCIPI