| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for enabling fast operation of the semiconductor photosensitive element, the semiconductor element used for the mounting structure and a mounting substrate. SOLUTION: The mounting structure connects the semiconductor photosensitive element to a mounting substrate 302. The semiconductor photosensitive element has a photodetection part 308 which generates a detection current in response to incident light, a first conductivity type contact part 316 which is provided to one end of the photodetection part and is formed of a conductive material and a first conductivity type connection part 318 connected to the other end of the photodetection part. The mounting substrate has a holding part 322 which is formed on a recess formed in the mounting substrate and is formed to a beam shape at least one end of which is fixed, a second conductivity type contact part 326 which is provided to a holding part, is formed of a conductive material and is in contact with the first conductivity type contact part and a second conductivity type connection part 332 which is electrically connected to the first conductivity type connection part via a prescribed flux. COPYRIGHT: (C)2004,JPO&NCIPI |
