发明名称 SOLID-STATE IMAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus capable of being compatible with requirements of downsizing, the increased number of pixels, and low power consumption. SOLUTION: The solid-state imaging apparatus is provided with: a board; photodiodes PD formed on the board in a way of forming rows and columns at a prescribed arrangement interval wherein adjacent rows and adjacent columns are laid out while being relatively deviated; control circuits (Ta, Tb, Tc, and TL) for detecting signal electric charges stored in the photodiodes PD and transmitting an image signal resulting from amplifying the signal electric charges; signal lines VL provided to each of rows or columns comprising the photodiodes PD, and converters ADC provided corresponding respectively to the signal lines VL and converting the image signal. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004274578(A) 申请公布日期 2004.09.30
申请号 JP20030065109 申请日期 2003.03.11
申请人 TOSHIBA CORP 发明人 EGAWA YOSHITAKA;OSAWA SHINJI;TANAKA NAGATAKA
分类号 H01L27/146;H04N5/335;H04N5/369;H04N5/372;H04N5/374;H04N5/378;(IPC1-7):H04N5/335 主分类号 H01L27/146
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