发明名称 |
Heat sink with visible logo |
摘要 |
A heat sink is for an element to be cooled has a thermally conductive base (20) and a plurality of thermally conductive pins (24) or fins extending substantially perpendicular from the base (20), said pins (24) or fins being arranged in a predetermined pattern. The pins (24) at least partially frame thermally conductive projections extending substantially perpendicular from said base (20) which forming a discernable logo (26) having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo (26) performs cooling of the components within a package. <IMAGE> |
申请公布号 |
EP1463112(A2) |
申请公布日期 |
2004.09.29 |
申请号 |
EP20040004242 |
申请日期 |
2004.02.25 |
申请人 |
JDS UNIPHASE CORPORATION |
发明人 |
GENOVA, RONALD R.;STACKHOUSE, DUANE S. |
分类号 |
H01L23/36;H01L23/367;(IPC1-7):H01L23/36;H01L23/544 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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