发明名称 Heat dissipation apparatus and method
摘要 Disclosed are a heat dissipation computer and method. In one embodiment, a heat dissipation apparatus comprises a heat sink that is adapted to receive a processor mounted thereto, the heat sink comprising an internal chamber that is adapted to receive a fluid flow that removes heat from the heat sink. In one embodiment, a method for dissipating heat generated by a processor comprises forcing fluid through an internal chamber formed within a heat sink to which the processor is mounted, forcing the fluid from the internal chamber of the heat sink through at least one hollow prong that extends from the heat sink and that is in fluid communication with the internal chamber of the heat sink, and forcing fluid over exterior surfaces of the at least one hollow prong.
申请公布号 GB0418976(D0) 申请公布日期 2004.09.29
申请号 GB20040018976 申请日期 2004.08.25
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. 发明人
分类号 H01L23/367;H01L23/467 主分类号 H01L23/367
代理机构 代理人
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