High frequency module device and method for its preparation

摘要

A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.