发明名称 |
Packaging platform having an adjustable thickness |
摘要 |
A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.
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申请公布号 |
US2004178107(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20030386398 |
申请日期 |
2003.03.11 |
申请人 |
HAGGARD CLIFTON C.;THOMAS JAMES R.;CHEN SONG PING;LIU RU ZHENG |
发明人 |
HAGGARD CLIFTON C.;THOMAS JAMES R.;CHEN SONG PING;LIU RU ZHENG |
分类号 |
B65D57/00;B65D85/86;H01L21/673;(IPC1-7):B65D73/00 |
主分类号 |
B65D57/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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