| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a highly reliable tape carrier for a semiconductor device which prevents excessive precipitation (needle crystal) of tin in a lead side surface and prevents generation of short circuit between leads. SOLUTION: In the manufacturing method of a semiconductor tape carrier, a conductor foil 3 stuck on an insulating tape material 1 is patterned and a wiring pattern with a plurality of leads 3a is formed. After resist 5 is formed to cover an area excepting the plating formation part of the wiring pattern, a plating layer 6 is formed in the plating formation part. In the method, etching is carried out for smoothing the surface and the side surface of the lead 3a as pretreatment for forming the plating layer 6. Since the length of needle crystal produced with formation of the plating layer 6 is thereby shorter than a clearance between the leads 3a, generation of short circuit can be prevented. COPYRIGHT: (C)2004,JPO&NCIPI
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