Poliermaschine

摘要

The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier (12) is formed into a thin plate having a through-hole (12a) in which a work piece (10) is accommodated. An upper polishing plate (14) polishes an upper face of the work piece (10). A lower polishing plate (16) pinches the work piece (10) with the upper polishing plate (14) and polishes a lower face of the work piece (10). A driving mechanism (20) moves the carrier (12) along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece (10), which has been pinched between the polishing plates (14, 16), are polished by the polishing plates (14, 16).