| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board for LED die mounting whose thickness is relatively thin, whose manufacturing processes are reduced, whose costs are low; and to provide a method for manufacturing the printed circuit board. <P>SOLUTION: This printed circuit board whose upper face is formed with a plurality of flat bottom cup-shaped holes for mounting a plurality of LED dies 5 is constituted of almost flat board-shaped first and second substrates 2 and 3. The first substrate 2 is provided with upper and lower two faces 21 and 22, and formed with a plurality of cup-shaped through-holes 23 put through the upper and lower two faces 21 and 22 so that those diameters can be smoothly reduced from the upper face to the lower face. The second substrate 3 is formed with a printed circuit 33, and its upper face 31 is adhered to the lower face 22 of the first substrate 2 so that the flat bottoms of the respective cup-shaped through-holes 23 can be formed. Also, the face on the second substrate 3 where the flat bottoms of the respective flat bottom cup-shaped holes are formed is provided with at least one electric connecting pad 34 electrically connected to the printed circuit board 33. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
