发明名称 |
Method for fabricating a thin line structure, multilayered structure and multilayered intermediate structure |
摘要 |
On a given silicon substrate is epitaxially grown a strain-relaxed silicon germanium layer with penetrated dislocations and formed a metallic layer to form a multilayered intermediate structure, which is heated. In this case, metallic elements of the metallic layer are diffused through the penetrated dislocations of the silicon germanium layer to form a thin line structure made of metallic silicide at a boundary face between the silicon base and the silicon germanium layer.
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申请公布号 |
US2004166329(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20030660578 |
申请日期 |
2003.09.12 |
申请人 |
NAGOYA UNIVERSITY |
发明人 |
SAKAI AKIRA;ZAIMA SHIGEAKI;YASUDA YUKIO;NAKATSUKA OSAMU |
分类号 |
H01L21/3205;B32B15/00;H01L21/768;H01L23/52;(IPC1-7):B32B15/00 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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