发明名称 Method for fabricating a thin line structure, multilayered structure and multilayered intermediate structure
摘要 On a given silicon substrate is epitaxially grown a strain-relaxed silicon germanium layer with penetrated dislocations and formed a metallic layer to form a multilayered intermediate structure, which is heated. In this case, metallic elements of the metallic layer are diffused through the penetrated dislocations of the silicon germanium layer to form a thin line structure made of metallic silicide at a boundary face between the silicon base and the silicon germanium layer.
申请公布号 US2004166329(A1) 申请公布日期 2004.08.26
申请号 US20030660578 申请日期 2003.09.12
申请人 NAGOYA UNIVERSITY 发明人 SAKAI AKIRA;ZAIMA SHIGEAKI;YASUDA YUKIO;NAKATSUKA OSAMU
分类号 H01L21/3205;B32B15/00;H01L21/768;H01L23/52;(IPC1-7):B32B15/00 主分类号 H01L21/3205
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