发明名称 |
ALTERNATIVE FLIP CHIP IN LEADED MOLDED PACKAGE DESIGN AND METHOD FOR MANUFACTURE |
摘要 |
A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the leadframe structure, and comprises a window. A semiconductor die comprising an edge is mounted on the die attach region and is within the window. A gap is present between the edge of the semiconductor die and the molding material. |
申请公布号 |
WO2004073031(A2) |
申请公布日期 |
2004.08.26 |
申请号 |
WO2004US03633 |
申请日期 |
2004.02.09 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION;MANATAD, ROMEL, N. |
发明人 |
MANATAD, ROMEL, N. |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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