| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can realize a three-dimensional mounting structure for different types of packages, and to provide an electronic device, electronic equipment, a method of manufacturing semiconductor device, and a method of manufacturing electronic device. <P>SOLUTION: In the semiconductor device, carrier substrates 21 and 31 are mounted on a carrier substrate 11 so that the ends of the substrates 21 and 31 may be disposed on a semiconductor chip 13 by respectively joining projecting electrodes 26 and 36 to lands 12c provided on the carrier substrate 11. In addition, the semiconductor device is provided with a first semiconductor package mounted with a first semiconductor chip and a second semiconductor package supported on the first semiconductor package so that its end may be disposed on the first semiconductor chip. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
