| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device in which a semiconductor chip can be mounted easily on a circuit board and electrically connected surely therewith by preventing the semiconductor chip from being stripped from the circuit board due to thermal stress, or the like. SOLUTION: The semiconductor device is formed by combining the semiconductor chip 10 having a through hole 10a formed in the thickness direction while being aligned with the arranging position of an electrode terminal 10b formed on an electrode terminal forming surface, and the circuit board 12 provided with a pin bump 30 formed to coincide with the planar arrangement of the through hole 10a while being connected electrically with a wiring pattern 32. The pin bump 30 formed on the circuit board 12 is inserted into the through hole 10a of the semiconductor chip, bonding adhesive 40 is applied to the forward end of the pin bump 30 inserted into the through hole 10a, and the semiconductor chip 10 is mounted on the circuit board 12 with the electrode terminal 10b of the semiconductor chip 10 being connected electrically with the wiring pattern 32 on the circuit board 12. COPYRIGHT: (C)2004,JPO&NCIPI |
